琳得科LINTEC UV膜  玻璃/晶圆切割 ADWILL D系列 琳得科不干胶ADWILL D系列 膜

我公司***代理琳得科ADWILL D系列UV膜，用于玻璃，晶圆，基板，陶瓷片等产品的切割。产品线齐全，价格优势，欢迎来电咨询。

Two types of back grinding tape are ***ailable. The "E series" which can be removed without placing stress on the wafer by decreasing adhesion by UV irradiation, and the "P series" which is non-UV type. In addition, there is the "S series" peeling tape.

• D series (UV Curable Dicing Tape)

Product Information

Adwill D series is an epoch-making line of UV curable dicing tapes whose features can be changed in ordance with operational process. The tape's strong adhesion secures wafers during dicing, and then is reduced by UV irradiation to facilitate pick-up. This dicing tape is essential for full-cut dicing of wafers to improve die quality, and fully applicable to dies of multiple sizes.

1. Secures wafers with strong initial adhesion to ensure dicing without any slipping or peeling even for ***all dies.

2. Supports instant control of adhesion by UV irradiation, allowing large dies to be picked up easily.

3. Causes no contamination by metal i*** or by adhesive residue on the wafer backside surface, and no adverse UV irradiation effects on ICs.

4. Prevents contact damage of dies with superb expandability, which is not reduced by UV irradiation.

5. Offers a variety of tape grades ranging from a tape with reduced tape chips at high speed, full-cut dicing to a special tape for thin wafers.

6. Provides special grades not only for wafer dicing but also for package, ceramic or glass dicing.

7. Provides various not only for blade dicing but also for laser dicing.

8. Supports the adhesive coating process environment that meets Class 100 (ANSI 209b) standa***.

ount tape Adwill D-series specification