|
|
|
|
Specificati*** MECAPOL P 400 • High capacity polishing machine. • Base plate Ø • Almag plate Ø easily removable. • Variable speed 30 to 300 Rpm. • C***tant torque. • Progressive acceleration. • 2 pre-selected speed 50/100 Rpm. • 2 direction rotation. • Power 750 Watts. • Digital display of speeds. • Touch sensitive keys with LED indicators. • Frame protected against rust corrosion. • Painted steel body. • Large proportional bowl, tilted and removable. • Water inlet driven by sluice gate. • Multi spray water cooling. • Voltage 230 V., single phase |
PE.RE B • Polishing head with central pressure. • Digital display of time and pressure. • Low pressure loading and unloading. • Touch sensitive keys. • Adjustable sweep (position, amplitude and velocity). • Tank for 150 ml of lubricant. • Adjustable and driven lubricant flow. • C***olidated spindle for intensive use. • Power 120 Watts. • Variable speed 20 to 80 Rpm. • Pneumatic pressure adjusted electronically from 0,5 to 40 daN. • Direct reading of pressure. • Voltage 230 V., single phase. |
Operating The MECAPOL P 400 can be used to prepare substrates of Ø 2 to 6“. • This machine has been designed for standard polishing as well as *** applicati***. • Due to quick changing of its wafer holder and its polishing plate, this polishing machine is very well adapted to development and laboratories applicati***. • As speed, load and time are adjustable, all processes can be achieved. |