特点：
上锡、吸锡、打磨、钻孔、点胶、芯片的安装和拆卸等。
LED 显示温度、密码锁定设定参数；温度自动回降及关闭
Features
- Universal ***T component installation and removal
- Self-Contained solder cream dispensing
- Multilayer repair capability
- Continuous automatic calibration
- Automatic tip offset compensation system
- Pik-Vac Component Handling Wand