千住水溶性锡膏

千住水溶性锡膏，千住水洗锡膏，千住水溶性锡膏 M705-515A(8)C1-T8G（无卤素锡膏）１．Scope This specification covers the solder paste, ECO SOLDER PASTE M705-515A(8)C1-T8G, using lead-free solder alloy, used for wiring connection and so on, of electrical and electronic parts. ２．Standard ２.１ Chemical composition of solder alloy（Test method ： STM-9-1） Composition and impurities are prescribed as following tables. Composition ( mass% ) Ａｇ3.0 &plu***n; 0.1 /Ｃｕ0.50 &plu***n; 0.05/Ｓｎ２.２ Melting temperature range and specific gr***ity of solder alloy(Reference value) Melting temperature range ℃ Approx. 217 ～ 220