WISE WS-500系列无卤素助焊膏是依照IEC无卤标准、欧盟《RoHS》标准及美国IPC-TM-650标准，适用于手机PCB,BGA等***D之返修助焊膏,采用全新高***化的高取值的改性松香树脂,润锡速度快,低烟,残留物少且表面绝缘阻抗值高。WS-500为免洗型助焊膏,残留物颜色非常淡,有极高之SIR值,建议用于BGA、CSP等球阵焊点返修及补焊。
WISE WS-500 Series Halogen-free solder paste is in accordance with the IEC standa***, the EU "RoHS" standa*** and the United States IPC-TM-650 standa***, which is appropriate for cell phone PCB, BGA, ***D reworketc…Use the modified rosin resin which has a new high antioxidant and high value.The solder paste is of instant wetting, low ***oke, low residue and high surface insulation resistance value. WS-500 is of wash-free property and the color of the residue is very light. The solder paste has a high SIR valueand is recommended being used for the reworking and re-welding of BGA, CSP and other solder points of ball array.