ALPHA OM5000含铅锡膏 HIGH SPEED, PIN TESTABLE, SOLDER PASTE
DESCRIPTION
ALPHA OM-5000 is a no-clean solder paste formulated for optimum performance in a wide variety of applicati***. The semi-soft, highly reliable residues provide a very low incidence of first probe false readings. ALPHA OM-5000 can be squeegee or pump printed at high speeds.
FEATURES & PROCESS BENEFITS
• Alpha OM-5000 prints at squeegee speeds up to 200mm/sec with c***istent print volumes and definition after pauses up to 7 hours.
• Excellent resistance to hot and cold slump for(Contour stability) minimizing bridge formation.
• Excellent wetting characteristics and co***etics on all types of pad finishes (incl. OSP) even after multiple reflow excursi***.
• Penetrable post reflow flux residues to maximize pin testability (ICT).
• ALPHA OM-5000 exhibits long stencil and tack life > 8 hours (25-75% RH).
***AILABILITY
• Alloy: 63Sn/37Pb, 62Sn/36Pb/2Ag
• Rheology: Squeegee & Pump Printing (MPM Rheopump and DEK ProFlow)
• Metal Percentage: 90%
• Powder Size: Type #3 (-325+500 mesh per IPC J-STD-006)
• Packaging Sizes: ***all and large jars, 6” and 12” cartridges and ProFlow TM cassettes.
APPLICATI***
Formulated for standard and fine pitch printing through stencil apertures as ***all as 0.007 inches (0.2 mm). Suitable for use across a wide variety of process settings. ALPHA OM-5000 is especially suitable for printing on assemblies that will receive in circuit test probing.
SAFETY
While the ALPHA OM-5000 flux system is not c***idered toxic, its use in typical reflow will generate a ***all amount of reaction and decomposition vapors. These vapors should be adequately exhausted from the work area. C***ult the MSDS for additional safety information, and for toxicity data on alloys containing lead and silver.
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