ALPHA 615助焊剂 SERIES Super RMA Fluxes
GENERAL DESCRIPTION
ALPHA 615 flux meets MIL-F-14256 requirements for flux type RMA, making it suitable for all Military work requiring
conformance to DOD-STD-2000. ALPHA 615 also meets the IPC-SF-818 standard for type LR3NC, the lowest flux
residue corrositivity category and the highest surface insulation resistance rating.
The standard solids content for ALPHA 615 is 37%. Where use of a lower solids flux is appropriate, such as when w***e soldering surface mount boa***, 615-25 (25% solids) and 615-15 (15% solids) are ***ailable.
FEATURES & BENEFITS
• Maximum achievable RMA activity. Very fast wetting flux.
• Very cleanable, even with high preheat. No white residue.
• Excellent foaming properties. Uniform, c***istent flux coverage.
• Perfect for high reliability rework.
ACTIVITY
ALPHA 615 is the most effective soldering flux yet developed for achieving excellent soldering yields with complex
Military assemblies, while clearly passing all requirements for an RMA, non-conductive, non-corrosive flux.
Wetting balance and solder spread tests are widely used quantitative measures for comparing flux activity. The faster the speed of solder wetting, as measured by the wetting balance, and the greater the area of solder spread, i.e. spread factor percent, the more efficient the flux is for promoting solder wetting. The superior activity of ALPHA 615 can be seen from the following test data:
Alpha 615 Brand A Brand B
Spread Factor1 91.7% 90.2% 86.8%
Wetting Speed2 0.41 seconds 0.47 seconds 0.64 seconds
1 Test conducted using oxidized copper and 60Sn/40Pb
flowed at 500°F for 15 seconds.
2 Test conducted using oxidized copper, 60Sn/40Pb at 500°F,
5 mm immersion depth and 10 second cycle time. Wetting
speed measured as time for wetting to reach equilibrium.
ALPHA 615 has also dem***trated the ability to prevent solder icicle formation, when tested according to the method
developed by Philips-Eindhoven, Netherlands, “Determination of the Flux Efficiency to Prevent Formation of Icicles (and Bridges).”
USE
ALPHA 615 is designed for w***e soldering printed circuit assemblies that must use an RMA flux meeting military
specificati***. While formulated to h***e excellent foaming properties, w***e and spray fluxing, along with various rework application methods can also be used.
All three solids levels of ALPHA 615 flux should be maintained by periodic measurement of flux specific gr***ity
(corrected to 77°F) and kept to within +0.015 and -0.005 of the nominal values.
While topside preheat temperatures of 180-200°F are sufficient for ALPHA 615 flux activation, higher preheat
conditi*** may be required for assemblies that h***e significant heat sinking characteristics, or when attempting to minimize the temperature gradient that ceramic chip components see between preheat and the solder w***e.
Under conditi*** of extreme preheat, most RMA fluxes become extremely difficult to clean after soldering, especially with mild fluorocarbon-blend solvents. ALPHA 615 flux residues clean very well with either mild fluorocarbon-blend solvents or aqueous saponifier (Alpha 2110).
PACKAGING
ALPHA 615 series fluxes are ***ailable in 1, 5 and 55 gallon containers. Write Flux flux pens are also ***ailable.
HEALTH & SAFETY
ALPHA 615 is flammable. Keep away from heat, sparks and open flames. Observe standard precauti*** for handling
and use, such as in well-ventilated areas and ***oidance of prolonged or repeated contact with skin.