ALPHA NC200免洗助焊剂
ALPHA NC-200 provides the broadest process window for a no-clean flux with less than 5% solids content. ALPHA NC-200 is designed to provide excellent soldering results (low defects rates), even when the surfaces to be soldered (component leads and pads) are not highly solderable. ALPHA NC-200 works particularly well with bare copper boa*** protected with organic or rosin/resin coatings and with tin-lead coated PCBs.
GENERAL DESCRIPTION
ALPHA NC-200 is a very active, low solids, no-clean flux. It is formulated with a proprietary activator system. A ***all percentage of rosin is added for enhanced thermal stability. The activators are designed to provide the broadest operating window for a low solids, no-clean flux, while maintaining a high level of long-term electrical reliability. After w***e soldering, ALPHA NC-200 le***es a low level of non-tacky residue, which is easily penetrable in pin testing.
FEATURES & BENEFITS
• Highly active for excellent soldering and low defect rates.
• Low level of non-tacky residue to reduce interference with pin testing.
• Cleaning is not required which reduces operating costs.
• Reduces the surface tension between solder mask and solder to significantly reduce solder ball frequency.
• Meets Bellcore requirements for long-term electrical reliability.
APPLICATION GUIDELINES
PREPARATION – In order to maintain c***istent soldering performance and electrical reliability, it is important to begin the process with circuit boa*** and components that meet established requirements for solderability and ionic cleanliness. It is suggested that assemblers establish specificati*** on these items with their suppliers and that suppliers provide Certificates of Analysis with shipments and/or assemblers perform incoming inspection. A common specification for the ionic cleanliness of incoming boa*** and components is 5μg/in2
maximum, as measured by an Omegameter with heated solution.
Care should be taken in handling the circuit boa*** throughout the process. Boa*** should always be held at the edges. The use of clean, lint-free gloves is also recommended. When switching from one flux to another, the use of a new foam stone is recommended (for foam fluxing).
Conveyors, fingers and pallets should be cleaned. ALPHA ***-110 and BIOACT SC-10 Solvent Cleaners h***e been found to be very useful for these cleaning applicati***. When foam fluxing, do not use hot fixtures or pallets. Hot fixtures/pallets will deteriorate the foam head.
FLUX APPLICATION – ALPHA NC-200 is formulated to be applied by foam, w***e or spray methods. When foam fluxing, the foam fluxer should be supplied with compressed air which is free of oil and water. Keep the flux tank full at all times. The flux level should be maintained 1 inch to 1-1/2 inches above the top of the stone. Adjust the air pressure to produce the optimum foam height with a fine, uniform foam head.
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Physical Properties
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Typical Values
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Parameters/Test Method
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Typical Values
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Appearance
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Pale Yellow Liquid
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pH(5%aqueoussolution)
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3.4
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Solids Content, wt/wt
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4.1
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Recommended Thinner
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ALPHA 425
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Specific Gr***ity @ 25°C (77°C)
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0.792 &plu***n; 0.003
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Shelf Life
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18 months
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Acid Number (mg KOH/g)
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15.5
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IPC J-STD-004 Designation
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ROL0
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Flash Point (T.C.C.)
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56°F (13°C)
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Bellcore GR78-CORE, Issue 1
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Yes
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Pounds Per Gallon
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6.6
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Container Size ***ailability
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1, 5 and 55 Gal.
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汉泰电子辅料有限公司是大陆地区***早从事***T工艺研究与制作的贸易商之一。公司具有多年电子行业从业经验，拥有一支高素质的***技术团队，专注服务于***T和PCB工艺制造焊接材料领域，主营阿尔法助焊剂、阿尔法锡膏、千住锡膏、阿米特锡膏、减摩锡膏、KOKI锡膏、铟泰锡膏、田村锡膏、***T贴片红胶、富士红胶、乐泰胶水、锡丝、锡条等***T焊接材料，欢迎来电咨询洽谈，我们将竭诚为您服务。
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