ALPHA NR330无挥发免洗助焊剂
VOC-FREE1 NO-CLEAN FLUX
GENERAL DESCRIPTION
ALPHA NR330, former lab development #9225, is a VOC-free halide-free, rosin/resin-free, low solids no-clean flux which provides the highest activity of any VOC-free Bellcore compliant flux for defect-free soldering. It is formulated with a proprietary mixture of organic activators which deliver excellent wetting and top-side hole fill, even with OSP coated bare copper boa*** which h***e undergone prior thermal excursi***. Several proprietary additives are also formulated into ALPHA NR330 which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation. The formulation of ALPHA NR330 is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.
FEATURES & BENEFITS
• Bellcore compliant for assemblies requiring this standard.
• VOC-free to help meet air quality regulati***.
• Exceptional wetting for excellent hole-fill even with organically coated bare copper boa***, with prior reflows.
• Thermally stable activators provide low solder bridging.
• Reduces the surface tension between solder mask and solder to provide low solderball frequency.
• Very low level of non-tacky residue to reduce interference with pin testing and good board co***etics.
• Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag.
APPLICATION GUIDELINES
PREPARATION - In order to maintain c***istent soldering performance and electrical reliability, it is important to begin the process with circuit boa*** and components that meet established requirements for solderability and ionic cleanliness. It is suggested that assemblers establish specificati*** on these items with their suppliers and that suppliers provide Certificates of Analysis with shipments and/or assemblers perform incoming inspection. A common specification for the ionic cleanliness of incoming boa*** and components is 5µg/in
2 maximum, as measured by an Omegameter with heated solution. Care should be taken in handling the circuit boa*** throughout the process. Boa*** should always be held at the
edges. The use of clean, lint-free gloves is also recommended.
Conveyors, fingers and pallets should be cleaned. Bioact SC-10 Solvent Cleaner has been found to be very useful for these cleaning applicati***.
FLUX APPLICATION - NR330 is formulated to be applied by spray method. When spray fluxing, the uniformity of the coating can be visually checked by running a piece of cardboard over the spray fluxer or by processing a board-sized piece of tempered glass through the spray and then through the preheat section.
|
Physical Properties
|
Typical Values
|
Parameters/Test Method
|
Typical Values
|
|
Appearance
|
Clear, Colorless Liquid
|
pH
|
2.35
|
|
Solids Content, wt/wt
|
4.0
|
Recommended Thinner
|
DI Water
|
|
Specific Gr***ity @ 25°C
(77°F)
|
1.013 &plu***n; 0.003
|
Shelf Life
|
18 months
|
|
Acid Number (mg KOH/g)
|
38.0 &plu***n; 2.0
|
Container Size ***ailability
|
1, 5 and 55 Gal.
|
|
Flash Point (T.C.C.)
|
NONE
|
IPC J-STD-004 Designation
|
ORL0
|
汉泰电子辅料有限公司是大陆地区***早从事***T工艺研究与制作的贸易商之一。公司具有多年电子行业从业经验，拥有一支高素质的***技术团队，专注服务于***T和PCB工艺制造焊接材料领域，主营阿尔法助焊剂、阿尔法锡膏、千住锡膏、阿米特锡膏、减摩锡膏、KOKI锡膏、铟泰锡膏、田村锡膏、***T贴片红胶、富士红胶、乐泰胶水、锡丝、锡条等***T焊接材料，欢迎来电咨询洽谈，我们将竭诚为您服务。
更多产品信息请登录http://