Typical Applicati***:
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applicati*** where a metal housing is used as heatsink.
Specification Sheet:
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Typical Properties of K200 |
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| Properties | Units | Metric Value | Test Method |
| C***truction & Composition | ---- | Silicone & Ceramic filled | ---- |
| Color | ---- | Dark Gray | Visual |
| Thickness Range | mm | 0.5~6.0 | ---- |
| Hardness | Shore C | 25 | ASTM D2240 |
| Density | g/cc | 2.79 | ASTM D792 |
| Tensile Strength | KN/m | 0.33 | ASTM D412 |
| Elongation | % | 78% | ASTM D412 |
| Continuous Use Temp | -40 to 150 | EN344 | |
| Breakdown Voltage | Kv/mm | ≥6.0 | ASTM D149 |
| Volume Impedance | ohm-cm | 1.1*1016 | ASTM D257 |
| Dielectric C***tant | 1MHz | 5.75 | ASTM D150 |
| Weight Daminify | ---- | ≤0.3 | @150 240H |
| Flame Rating | ---- | V-0 | UL 94 |
| Thermal Conductivity | W/m.k | 2.0 | ASTM E1461 |
| UL, RoHS, REACH | ---- | Compliance |
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