Thermal pad Applicati***:
- Between electronic components such as Semiconductor, IC, High performance GPU.MOS and heatsink.
- Led Lighting, LCD TV, LED Backlight TV,Power supply etc
- Telecom device, Wireless Hub, Memory Modules,RAM IC, in all applicati*** where a metal housing is used as heatsink.
Specification sheet:
| Typical Properties of K150 | |||
| Properties | Units | Metric Value | Test Method |
|
C***truction & Composition |
---- | Silicone & Ceramic filled | ---- |
| Color | ---- | Dark Gray | Visual |
| Thickness Range | mm | 0.5~12.0 | ---- |
| Hardness | Shore C | 25 | ASTM D2240 |
| Density | g/cc | 2.5 | ASTM D792 |
| Tensile Strength | KN/m | 0.5 | ASTM D412 |
| Elongation | % | 70% | ASTM D412 |
| Continuous Use Temp | °C | -40 to 150 | EN344 |
| Breakdown Voltage | Kv/mm | ≥5.0 | ASTM D149 |
| Volume Impedance | ohm-cm | 8.0 x 1015 | ASTM D257 |
| Dielectric C***tant | 1MHz | 5.75 | ASTM D150 |
| Weight Damnify | ---- | ≤0.3% | @150°C 240H |
| Flame Rating | ---- | V-0 | UL 94 |
| Thermal Conductivity | W/m.k | 1.5 | ASTM E1461 |
| UL, RoHS, REACH | ---- | Compliance | |