Thermal Pad Typical Applicati***:
- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applicati*** where a metal housing is used as heatsink.
Specification Sheet:
|
Typical Properties of K100 |
|||
| Properties | Units | Metric Value | Test Method |
|
C***truction & Composition |
---- | Silicone & Ceramic filled | ---- |
| Color | ---- | Dark Blue | Visual |
| Thickness Range | mm | 0.5~12.0 | ASTM D374 |
| Hardness | Shore C | 25 | ASTM D2240 |
| Density | g/cc | 2.2 | ASTM D792 |
| Tensile Strength | KN/m | 0.75 | ASTM D412 |
| Elongation | % | 90% | ASTM D412 |
| Continuous Use Temp | -40 to 150 | EN344 | |
| Breakdown Voltage | Kv/mm | ≥4.0 | ASTM D149 |
| Volume Impedance | ohm-cm | 1.5*1016 | ASTM D257 |
| Dielectric C***tant | 1MHz | 4.87 | ASTM D150 |
| Weight Daminify | ---- | ≤0.5 | @150 240H |
| Flame Rating | ---- | V-0 | UL 94 |
| Thermal Conductivity | W/m.k | 1.0 | ASTM E1461 |
| UL, RoHS, REACH | ---- | Compliance | ---- |