|
粘合材料类型 |
电子元件 |
保质期 |
6（个月） |
TYPICAL PROPERTIES OF UNCURED MATERIAL
|
ITEM |
CONDITION |
SPECIFICATION |
REMARKS |
|
Appearance |
Visual Inspection |
Red paste |
Red paste |
|
Viscosity(Poise) |
Malcom,@25?C ,30rpm |
550~650 |
583 |
|
Thixotropic Index |
3rpm/30rpm |
≥4.0 |
5.3 |
|
Solid Content (wt%) |
− |
98~100 |
99.9 |
|
Specific Gr***ity |
@4?C |
1.0~1.4 |
1.2 |
|
Cure Condition |
@120?C |
≥120 sec |
120 sec |
|
@130?C |
≥100 sec |
|
|
|
@150?C |
≥60 sec |
|
|
|
Work Life |
@25?C |
7 days |
|
|
Shelf Life |
@5~10?C,≤40%RH |
6 months |
|
PHYSICAL PROPERTIES OF CURED MATERIAL
|
ITEM |
CONDITION |
SPECIFICATION |
REMARKS |
|
Corrosion |
40?C,95%RH,96Hours |
Not Occurred |
|
|
Moisture Absorption（wt%） |
40?C，H2O，24Hours |
≤1.0 |
|
|
Tensile Strength (kgf/cm?2;) |
20~25?C,PCB(FR-4) |
≥120 |
|
|
Insulation Resistance (Ω) |
40?C,95%RH,96Hours |
≥1×1012 |
|
|
Dielectric C***tant (1MHz) |
− |
≤4.0 |
|
|
Dissipation Factor (1MHz) |
− |
≤0.05 |
|
|
Glass Transition Temperature (Tg, ?C) |
DSC |
≥80 |
|
|
Coefficient of Thermal Expansion (CTE,ppm/?C) |
TMA |
a1:60 (Pre Tg) |
|
|
a2:195 (Post Tg) |
|||
|
Thermal Resistance (sec) |
245~285?C |
11~15 |
|
|
Withstanding Voltage (kV) |
40?C,95%RH,72Hours |
1.8~2.2 |
|
|
Chemical Resistance |
IPA,25?C,24Hours |
≤0.1 |
|
|
Adhesion Strength (2012 Chip) |
20~25?C，PCB（FR-4） |
≥2.0 |
|
|
Hardness |
Shore D |
80~90 |
|