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FEATURES

     ●Same size with IC, can be assembled by any automatic IC inserter.
     ●Molded 0.3" integrated circuit packing outline allowing automatic insertion.
     ●***aller size makes better heat convection during PC board reflow w***e soldering.
     ●Top tape sealed to withstand w***e soldering, board washing.
     ●All plastics are UL 94V-0 grade fire retardant.
     ●Gold plated contact to ensure low contact resistance and Tin plated terminals to prevent
       contamination during soldering.