CT-285高导热银胶简介：
“KEMITITE CT285“是由日本京瓷化学株式会社（KYOCERA chemical Corporation)生产的一种环氧树脂无溶剂型芯片粘接剂；具有25W/mK的高热导率。
由于胶水为低吸湿性的树脂体系，因而具有良好的回流表现。能有效地用于功率集成电路、晶体管。
特点：
1.由于胶水为单组分无溶剂性，因而具有良好的操作性。
2.具有25W/mK的高热导率。
3.无爬胶现象。
详细介绍：
单组份，导热系数25W/mK，适合3-5W大功率LED和模组。自动点胶机适用。
Introduction
Die Attach Paste ”KEMITITE CT285” is epoxy resin based and solvent free Type paste.
The highest thermal conductivity (25W/mK)
Good reflow performance due lower moisture absorption resin system.
CT285 is effectively used for power IC, transistor.
Features
1） Good workability for dispensing due to solvent free and one liquid type paste.
2） Highest thermal conductivity(25W/mK)
3） Bleed less.
General Property
Properties
Unit
Typical Value
Test Method
Appearance
–
Silver Filled Paste
Visual
Viscosity at 25CPa·s100EHD Viscometer 0.5rpm3°cone)
Thixotropic Index
–6.0 0.5rpm/2.5rpm
Non Voletile
Wt%92.0 180C×2hr
Silver Content
Wt%87.5 600C×3hr
Adhesive Strength
25c300CN3020
Frame: Cu/PPF
Chip Size: 2×2mm
Volume Resistivity
8×10-6
Cure: 200C×90min
Measurement: Room Temp
Glass Transition Temperature
C200TMA
Modulus(25C)
25CGPa16.5DMA
260C 7.8
CTE
Alpha 1Ppm75TMA
Alpha 2
200
Ionic Impurity
Nappm61
Atomic Absorption
Ionchromatography
CIThermal Conductivity
W/m K25
Laser Flash
4. Standard Cure Condition
175C×60-90min
5. Remarks
Storage condition is _30 to _15C 6 month