T-flex540同款导热硅胶垫，导热系数3.0W/m-k，自粘型图片T=1.0mm

JGTP-1030 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can tran***it to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. JGTP-1030 系列热传导界面材料是填充 发热器件和散热片或金属底座之间的空气间隙，它们的柔性、弹性特征使其能够用于覆 盖非常不平整的表面。热量从分离器件或整个 PCB 传导到金属外壳或扩散板上，从而能 提高发热电子组件的效率和使用寿命。