IP3
1.贴片范围:1005(in.0402)-74mmx74mm, 高度10mm以下的零件,可贴BGA零件
2.贴片速度:小IC0.55s/chip,大IC1.25s/chip,盘装IC2.5s/chip
3.贴片精度:&plu***n;0.025mm
4.适用基板:***大508x457mm,***小80x50mm, 厚度0.5-4mm
5.料架支持:tape feeder***多74slots,stick feeder***多36slots,tray***多20 trays/MTU
6.机器尺寸:L3185mm,W2530mm,H1850mm(排除信号塔)
7.机器重量:4t(包括MTU5.1t)
1.贴片范围:1005(in.0402)-74mmx74mm, 高度10mm以下的零件,可贴BGA零件
2.贴片速度:小IC0.55s/chip,大IC1.25s/chip,盘装IC2.5s/chip
3.贴片精度:&plu***n;0.025mm
4.适用基板:***大508x457mm,***小80x50mm, 厚度0.5-4mm
5.料架支持:tape feeder***多74slots,stick feeder***多36slots,tray***多20 trays/MTU
6.机器尺寸:L3185mm,W2530mm,H1850mm(排除信号塔)
7.机器重量:4t(包括MTU5.1t)