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X3 Inline x-ray inspection system / 3D & Tran***ission

Inline x-ray inspection system for combined 3D and tran***ission x-ray analysis of double-sided boa*** with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360o angle shot coverage. A new 3D rec***truction software features the generation of detailed, high resolution slice images.

X3 3D High resolution in-line X-ray inspection system

The X3 provides a flexible approach to inspecting solder joints on a double-sided board. Through the ***art CAD Compiler, the board is segmented into a inspection strategy automated based on non-overlapping and over-lapping regi***. In non-overlapping regi***, 2D tran***ission views are taken. In overlapping areas, either the patented Slice Filter Technology (SFT) can be used to separate the overlapping components or the state-of-the-art 3D rec***truction technique called 3D-SART. 3D-SART allows for slice image sets through the entire assembly top to bottom with the highest resolution ***ailable in the market.

Key features

• Flexible inspection techniques (2D, 2.5D, 3D) based on board topology
• Off-Axis imaging (2.5D) specific for BGA devices to check for Head-In-Pillow (HIP) or Head-on-Pillow (HOP) and Barrel-Fill detection of Pin-in-Paste / THT connectors
• 3D Simultaneous Algebraic Rec***truction Technique (3D-SART) which produces industry leading slice image resolution

X-ray system features

• 130kV high resolution x-ray tube
• 2k x 2k digital flatpanel detector on x-y motion system
• 5-axis programmable motion system Algebraic rec***truction algorithm for 3D analysis (SART)
• MIPS inspection platform for off-line programming, analyzing and verification. Including a modular test algorithm library for solder joint inspection

Applicati***

• Double sided boa*** with high packing density and hidden solder joints
• Power components with heat sinks
• All standard ***D s and THT/PTH components
• Specific BGA and QFN applicati***
• MCM Modules
• Cooling plates/heatsink void inspection